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双层微通道热沉的热性能和结构特性分析

Abstract: Double layer micro-channel heat sink (DLMCHS) has been widely used in various electronic devices;however, the existence of the nonuniform thermal strain distribution in actual operation has adverse effect on the overall stability. In this paper, two optimized designs of DLMCHS with cutting baffles on top and bottom layers are presented based on the traditional DLMCHS. The heat transfer and thermal stress performance are numerically analyzed and compared with the traditional DLMCHS. The results indicate that cutting baffles of micro-channels remarkably improves heat transfer and thermal stress performance. The optimized design with cutting baffles on the bottom layer decreases thermal strain but deteriorates heat transfer performance. The model with cutting baffles on the top layer has better combined thermal strain and heat transfer performance, whichreduces thermal strain by about 1.5 times and enhances heat transfer by about 26.5%. For the design with cutting baffles on the top board, adding metal foam in the inlet collector can decrease the total minimum thermal strain by 51.4% and maximum temperature by 1.4 K, and increase the Nusselt number by 15%. These results indicatethat DLMCHS with cutting baffles on the top layer has great potential for thermal managements on electronic devices with high power density。


本文基于传统的双层微通道热沉,分别建立了截取上层和下层部分隔板的两种优化模型。通过数值计算获得传热和热应力性能,并与传统的双层微通道热沉对比。结果表明,截取部分流道隔板可以有效改善传热和热应力性能。截取下层流道隔板以恶化传热性能为代价降低了热应变,而截取上层流道隔板在降低1.5倍热应变的同时提升了约26.5%的换热性能。对截取上层流道隔板的模型进一步优化,在入口联箱中加入金属泡沫可以降低51.4%的热应力,1.4K的最高温度并增加15%的努塞尔数。这些结果表明在双层微通道热沉中采用截取部分流道隔板的方法,对大功率电子设备的换热有巨大潜力。


文章下载链接:

2019-2-12+XU+Yupeng.pdf